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Dopant imaging of power semiconductor device cross sections
JournalArticle (Originalarbeit in einer wissenschaftlichen Zeitschrift)
 
ID 3704675
Author(s) Gysin, U.; Meyer, E.; Glatzel, Th; Guenzburger, G.; Rossmann, H. R.; Jung, T. A.; Reshanov, S.; Schoener, A.; Bartolf, H.
Author(s) at UniBasel Meyer, Ernst
Glatzel, Thilo
Jung, Thomas
Year 2016
Title Dopant imaging of power semiconductor device cross sections
Journal Microelectronic Engineering
Volume 160
Pages / Article-Number 18-21
Abstract Several Scanning Probe Microscopy (SPM) methods allow to image dopant profiles in a range from 10(14) cm(-3) to 10(19) cm(-3) on semiconducting samples. In our work we present Scanning Capacitance Force Microscopy (SCFM) and Kelvin Probe Force Microscopy (KPFM) experiments performed on cross sections of silicon (Si) and silicon carbide (SiC) power devices and epitaxially grown calibration layers. The contact potential difference (CPD) shows under illumination a reduced influence on surface defect states. In addition results from numerical simulation of these microscope methods are discussed. (C) 2016 Elsevier B.V. All rights reserved.
Publisher Elsevier
ISSN/ISBN 0167-9317
edoc-URL http://edoc.unibas.ch/52661/
Full Text on edoc Restricted
Digital Object Identifier DOI 10.1016/j.mee.2016.02.056
ISI-Number 000378456000004
Document type (ISI) Article
 
   

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